Probes for LED Wafer Test

APS pins in small diameters and a variety of materials are the answer to the challenge of testing gold bumps and pads without damage to the gold surface in LED wafer test situations. Gold bumps require special care during wafer test to avoid damage. APS probes in the most suitable material and small diameters of .003-.004” have been used successfully in this challenging test situation. The quality of pins provided by APS for LED wafer test is unsurpassed.
Tungsten, Rungsten-rhenium and Beryllium-copper Material Properties